Articles from Advanced Semiconductor Engineering, Inc.

ISE Labs, Inc., a leading provider of semiconductor engineering services, today announced the acquisition of a significant parcel of land within Axis 2 Industrial Park, located in Tonalá, a city and municipality within the Guadalajara Metropolitan Area. This strategic land purchase demonstrates the company’s long-term commitment to the state of Jalisco and establishes a footprint for future expansion.

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Inc, NYSE: ASX, TWSE: 3711) today announced it has been honored with a prestigious Gold Award at the 2024 PwC Sustainability Impact Awards for its marine conservation film, Guardians of the Sea. Produced by ASE Corporate Communications Team in collaboration with ASE Environmental Protection and Sustainability Foundation, the film highlights ASE’s innovative approach to marine conservation and environmental stewardship, captivating global judges with its creative and compelling portrayal of the company’s sustainability initiatives and social impact.

ISE Labs, Inc., a leading provider of semiconductor engineering services, today announced it is broadening customer access to its world-class capabilities with the opening of a second U.S. facility, located in San Jose, Calif. Together, the Fremont and San Jose sites will double ISE’s available R&D lab and business space, reinforcing the company’s commitment to Silicon Valley while expanding its North American footprint and helping to strengthen the U.S. semiconductor supply chain. The grand opening ceremony for the new facility at 2201 Qume Drive in San Jose is set for tomorrow at 11:00 a.m. PDT.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSEASX) (TAIEX: 3711), today announced that it has introduced powerSiP™, a transformative power delivery platform designed to reduce signal and transmission loss while addressing current density challenges. ASE’s powerSiP™ platform today enables a vertically integrated multi-stage voltage regulator module (VRM) for higher system efficiency and lower power consumption and delivers a reduced footprint that is 25% smaller when compared to traditional side-by-side configurations. The powerSiP™ technology innovation allows a 50% increase in current density from 0.4A/mm² to 0.6A/mm² and a decrease in routing power loss from 12% to 6%, signifying a 50% reduction over a side-by-side configuration. With the Artificial Intelligence (AI) market size, reach, and impact still in early stage, ASE is innovating to meet related data center requirements, performance expectations, and power improvements, offered through powerSiP™.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSEASX) (TAIEX: 3711), today announced that it has extended its advanced interconnect technology under the VIPack™ platform to meet the accelerating demand for complex chiplet integration for artificial intelligence (AI) applications. This interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced microbump technology. Such new interconnect solutions are crucial for architects seeking to accomplish creativity and scale across 2D, or side-by-side, solutions as well as newer vertically integrated solutions, such as 2.5D and 3D packaging capabilities, under ASE’s VIPack™ platform.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of its Integrated Design EcosystemTM (IDE), a collaborative design toolset optimized to systematically boost advanced package architecture across its VIPackTM platform. This innovative approach allows a seamless transition from single die SoC to multi-die disaggregated IP blocks including chiplets and memory for integration using 2.5D or advanced fanout structures. ASE’s IDE enables design efficiencies up to 50% and sets new standards for quality and user experience. Integrating novel package design tool capabilities into ASE’s workflow has resulted in significant cycle time reduction while lowering customer costs.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced its latest Fan-Out-Chip-on-Substrate-Bridge (FOCoS-Bridge) technology breakthrough, achieved through qualifying a large 70mm x 78mm package that incorporates two ASICs and eight High Bandwidth Memory (HBM) devices connected through eight silicon bridges. This large package features two identical 47mm x 31mm FOCoS-Bridge fan-out structures integrated side-by-side, with each comprising an ASIC with four HBMs and four silicon bridges, effectively integrating nine components in each 47mm x 31mm fan-out package, which is almost 2X the silicon reticle size. Positioned under the ASE VIPack™ platform, this FOCoS-Bridge technology is designed to be highly scalable, enabling seamless integration into complex chip architectures while delivering high density die-to-die (D2D) connections, high input/output (I/O) counts, and high-speed signal transmission for evolving Artificial Intelligence (AI) and High-Performance Compute (HPC) requirements.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack™ has received the ‘Device Technology of the Year Award’ in the 2023 3D InCites Awards program. This accolade recognizes industry-wide contributions in the development of heterogeneous integration technologies including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that it has received the Texas Instruments (TI) 2022 Supplier Excellence Award. The annual award honors companies whose dedication and commitment in supplying products and services meet TI’s high standards for excellence. Recipients are an elite group of suppliers chosen for their exemplary performance in the areas of cost, environmental and social responsibility, technology, responsiveness, assurance of supply and quality.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced its most advanced Fan-Out-Package-on-Package (FOPoP) solution, developed to lower latency and deliver exceptional bandwidth advantages for the dynamic mobile and networking markets. Positioned under the ASE VIPack™ platform, FOPoP reduces the electrical path by 3x and enables bandwidth density by up to 8x, allowing engine bandwidth expansion up to 6.4 Tbps per unit. FOPoP is a prominent package pillar addressing complex architectural and integration requirements that help enable next generation solutions for application processors, antenna-in-package devices, and silicon photonics (SiPh) applications.

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX), announced today that its bumping factory in Kaohsiung has been inducted into the World Economic Forum’s Global Lighthouse Network (GLN), a community of manufacturing sites and value chains that are leaders in the adoption of Fourth Industrial Revolution (4IR) cutting edge technologies. ASE’s bumping factory in Kaohsiung is amongst the 18 GLN sites announced by the WEF on January 13th, joining the ranks of 132 leading manufacturers.

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Inc, NYSE: ASX, TWSE: 3711) hosted a groundbreaking ceremony today for the construction of a new semiconductor assembly and testing facility in Penang, Malaysia. The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today the industry’s first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated redistribution layer (RDL) and Chip Last (FOCoS-CL) semiconductor packaging solution that elevates the performance for High Performance Computing (HPC), under the ASE VIPack™ platform. This progression of fan-out technology offers breakthrough board level reliability and exceptional electrical performance while meeting integration requirements for networking and artificial intelligence applications that demand greater memory and compute power.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International Microelectronics Assembly & Packaging Society (IMAPS) has decided to award the 2022 Daniel C. Hughes, Jr. Memorial Award to ASE Fellow, Dr. William (Bill) Chen, for his lifetime achievement within the industry. The award was presented at a ceremony at IMAPS 2022 in Boston, Massachusetts by IMAPS President, Dr. Beth Keser.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today introduced VIPack™, an advanced packaging platform designed to enable vertically integrated package solutions. VIPack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.

Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, today announced it was the recipient of the Cisco 2021 Excellence in Technology Enablement Award. Cisco unveiled the award winners at its annual Supplier Appreciation Event (SAE). The 30th annual SAE was aired virtually for the second year in a row on Cisco TV on September 14, 2021.

Advanced Semiconductor Engineering, Inc. (ASE) announced today that it has received the 3D InCites 2021 Sustainability Award. This inaugural award honors exemplary achievement in reducing greenhouse gas (GHG) emissions, energy use, water use, and waste to landfill and recognizes the long-term, stringent sustainability goals put in place for the decade ahead.